In response to the surge in demand for AI computing power, a supercomputing center has taken the lead in using high thermal conductivity silicone rubber materials to optimize the heat dissipation system. This elastic gasket with added boron nitride filler has a thermal conductivity of 8W/m·K, which can accurately fit the surface of the GPU chip and reduce the core temperature by 12°C. Combined with AI dynamic frequency modulation technology, the overall energy consumption is reduced by 18%. The project leader said that the material has a lifespan of more than 50,000 hours and is environmentally friendly and recyclable. At present, Huawei, Sugon and other companies have started relevant tests, and it is expected to be widely used in the construction of intelligent computing centers in 2024.
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