With summer heat intensifying, smartphone overheating has become a major user complaint. High-performance silicone resin thermal pads and gels are now acting as "cooling patches" for electronics. Flagship devices from Huawei and Xiaomi extensively use these materials. Their soft, conformable properties fill microscopic gaps between chips and heat sinks, offering thermal conductivity 3x higher than traditional materials. As AI chip power consumption soars and foldable phones gain popularity, demand for thermally conductive silicones is surging. Chinese suppliers like Huitian New Material and Kangda New Material are expanding production. The global market is expected to reach $5 billion by 2026. Experts state: "This ‘silicone cooling layer’ has become essential in high-end electronics manufacturing."
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