The rapid advancement of electric vehicle (EV) intelligence and connectivity has led to increasingly complex electronic/electrical architectures. The computing power and power consumption of automotive-grade chips (e.g., for smart cockpits, autonomous driving domain controllers, power modules) continue to climb, making thermal management critical for system stability and longevity. In this context, thermal interface materials (TIMs) made from high-thermal-conductivity silicone rubber (especially addition-cure liquid silicone rubber), such as thermal pads, gels, and pastes, have become indispensable "thermal management guardians."

These silicone rubber materials are precisely applied to fill microscopic gaps between heat-generating chips (like NVIDIA's Orin) and heat sinks (like liquid cooling plates, fins). They possess excellent softness, compressibility, and high thermal conductivity (up to 5 W/mK or higher), effectively displacing air to establish an efficient "thermal conduction bridge" that rapidly transfers chip heat to the cooling system. Compared to traditional materials, silicone rubber TIMs also offer advantages like good electrical insulation, resistance to aging, and long-term reliability. With the adoption of 800V high-voltage platforms and the ongoing "arms race" in chip computing power, demand for high-performance thermal conductive silicone rubber is experiencing explosive growth.