4. Physical vapor deposition


Physical vapor deposition technology mainly includes high frequency sputtering (RFS), magnetron sputtering (MS), ion beam hybrid deposition (BIM), molecular beam epitaxy (MBE), atomic layer epitaxy (ALE), ion beam enhanced deposition (ED), electron beam assisted deposition (IBAD), electron beam evaporation (EB), pulsed laser deposition (PLD), electron beam physical vapor deposition (EB-PVD), etc.


Physical vapor deposition technology can be used to prepare nano-coatings of oxides, nitrides, and carbides, and can also deposit multi-layer or composite nano-coatings of metals and compounds. The prepared coating has strong adhesion and the workpiece is not subject to thermal deformation, but its equipment is expensive, the deposition efficiency is low, and it is not suitable for preparing thick coatings.