5. Chemical vapor deposition technology
Chemical vapor deposition (CVD) is a method of using gaseous substances to react chemically on solid surfaces to generate solid deposits. In fact, it is under certain temperature conditions that the mixed gas interacts with the surface of the substrate to decompose certain components in the mixed gas and form a solid film or thin film coating of metal or compound on the surface of the substrate. In recent years, technologies such as plasma-assisted chemical vapor deposition (PACVD) and electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) have emerged one after another and have been widely used in the preparation of nano-coating materials.


Compared with physical vapor deposition technology, chemical vapor deposition technology has the advantages of simple process, fast deposition speed, strong coating adhesion, continuous process and high product purity, and is suitable for coating complex workpieces. However, the reaction temperature of CVD is high, and its application is subject to certain restrictions.