Application in electronic packaging materials

As a new type of scarce mineral material, high-purity spherical nano-SiO2 has broad application prospects in many fields such as electronics and electrical appliances due to its superior properties such as high dielectric, high heat resistance, high moisture resistance, high filling content, low expansion, low stress, low impurities, and low friction coefficient. It is the main raw material required for large-scale and ultra-large-scale integrated circuit packaging.

At present, most electronic packaging materials at home and abroad are polymers, among which the most widely used is epoxy resin filled with 70%~90% high-purity spherical nano-silicon dioxide powder. The high water absorption and viscosity of epoxy resin limit its application in ultra-large-scale integrated circuits. A large amount of silica powder can be added to epoxy resin, which can reduce the thermal expansion coefficient, water absorption, internal stress, shrinkage rate of the plastic packaging material and improve thermal conductivity.